ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,455, issued on July 28, was assigned to UNIST (Ulsan National Institute of Science and Technology) (Ulsan, South Korea) and Postech Research... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,456, issued on July 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Ferroelectric-based memory devi... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,457, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Three-dimensional semiconductor memory devic... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,458, issued on July 28, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China). "Semiconductor structure and manufacturing method... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,459, issued on July 28, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Backside MRAM with frontside devices" was in... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,460, issued on July 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Memory device including a semicondu... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,461, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Integrated circuit device and electronic sys... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,462, issued on July 28, was assigned to KIOXIA Corp. (Tokyo). "Semiconductor device and method for manufacturing the same" was invented by ... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,463, issued on July 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Integrated circuit with thin fi... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,464, issued on July 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and method of ... Read More